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SINGAPORE: Mainboard-listed chip tester, STATS ChipPAC said on Tuesday that its copper wire bond programme is in volume production.
It said it has the capability to support customers in five different manufacturing locations in Asia.
The firm believes copper wire bonding has demonstrated feasibility as a low-cost alternative.
It added that copper wire bonding provides performance advantages over traditional gold wire bonding.
Such advantages include significantly better conductivity than gold or aluminium, improved electrical and thermal performance, and stronger mechanical properties.
STATS ChipPAC added that it has copper wire bond capabilities in its manufacturing locations in Malaysia, Singapore, South Korea, China and Thailand.
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