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SINGAPORE: Mainboard-listed chip tester STATS ChipPAC said Tuesday it has achieved an industry milestone in the volume ramp of its embedded Wafer-Level Ball Grid Array (eWLB).
It said it shipped more than 35 million units.
The firm said eWLB is an innovative technology that offers a high performance, power efficient semiconductor solution for the wireless and consumer markets.
It added eWLB delivers a higher integration level and greater number of contact elements at a reduced manufacturing cost as compared to other packaging technology available Tuesday.
STATS ChipPAC said its record ramp of eWLB is significant because it indicates this technology is quickly gaining acceptance as the package of choice for mobile applications.
-CNA/wk
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