Advanced chip packaging key to powering next generation of AI: Silicon Box
08:23 Min
Byung Joon Han, Co-founder and CEO of Silicon Box, speaks to CNA’s Angela Lim at the Singapore Week of Innovation and Technology 2026. He says advances in chiplet technology and semiconductor packaging could help improve chip performance and reduce costs, while Singapore’s research capabilities and stable business environment support innovation in the industry.
28 Oct 2026 03:38pm
Byung Joon Han, Co-founder and CEO of Silicon Box, speaks to CNA’s Angela Lim at the Singapore Week of Innovation and Technology 2026. He says advances in chiplet technology and semiconductor packaging could help improve chip performance and reduce costs, while Singapore’s research capabilities and stable business environment support innovation in the industry.
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